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SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.

All Products >> non-silicone based,thermal gel

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silicone free thermal putty k=1.5
silicone free thermal putty k=1.5
Specification: 300ml
Detail: XK-GN15 thermal gel provides high performance and ultra thin bond line. It has a high reliability, and never dry out even in severe environment applications. The wet out feature will reduce contact thermal resistance and optim...

2
silicone free thermal putty k=2.0
silicone free thermal putty k=2.0
Specification: 300ml
Detail: XK-GN20 is a one-part, dispensable thermal gel. It features high thermal perforance, ultra thin bond line. XK-GN20 will not pump out, drip off and never dry out even in severe environment applications. The wet out surface redu...

3
xk-gn30 is a non-silicone based, high performance and low therma
xk-gn30 is a non-silicone based, high performance and low therma
Specification: 300ml
Detail: XK-GN30 is a non-silicone based, high performance and low thermal impedance thermal gel. It has a high reliability, and never dry out even in severe environment applications. The wet-out feature will reduce contact thermal res...
Showing 1 - 3 of 3, total 1 pages        [First] [Previous] [Next] [Last]
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