SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.

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thermal gap filler k=2.0
Specification: 50/400ML
Detail: GLPOLY has launched an product¡ªthermal gap filler XK-S20 which could be equivalent to CGW-2. GLPOLY is the only one to develop such co***rable product to CGW-2 in China. We don¡¯t give customer a technical data sheet only,...

thermal gel k=3.2
Specification: 30/55/100/300ml
Detail: XK-G30 is a high performance, excellent thermal management solution for electronics assemblies. It is formulated to accommodate a variety of different bondline thickness and provide low thermal impedance at any gaps. XK-G30 t...

silicone free thermal compond k=0.8
Specification: 400ML
Detail: XK-SN10 is a two part thermal compound with high bond strength, it is supplied in two-part, suitable for automated dispensing. It can cure at room temperature, or can be accelerated with additional heat. It is ideal for motor ...

silicone free thermal compound k=1.5
Specification: 400ML
Detail: XK-SN20 is a two part, epoxy resin based thermal gap filling material with high bonding strength, this material is suitable for automated dispensing. It cures at room temperature or can be accelerated with additional heat. It ...

non silicone thermal grease k=1.0
Specification: 300ml
Detail: XK-XN10 is silicone-free based, high performance thermal management material with low thermal resistance. Non silicone thermal grease is non curing and non drip off, it is suitable for CPU and LED etc silicone sensitive appli...

non silicone thermal grease k=4.0
Specification: 300ml
Detail: XK-XN40 is designed for silicone-sensitive applications, eliminating the possibility of contamination and volatility of silicone products. This material provides low thermal resistance and ultra thin bondline thickness and def...

non silicone thermal grease k=4.6
Specification: 300ml
Detail: XK-XN50 is silicone-free based thermal management material desgined to solving the problem of contamination and volatility caused by silicone based products. The non silicone thermal grease is non curing and non drip off. It i...

silicone free thermal fiberglass k=3.0
Specification: 320*320*0.25
Detail: XK-FN30 is designed for applications requiring high thermal performance and electrically insulation. It is compliant with surfaces, reducing contact thermal resistance. The smooth and compliant surface will optimize thermal pe...

non silicone thermal insulator k=1.5
Specification: 320*320*0.25
Detail: XK-FN15 non silicone thermally conductive insulator provides excellent eletrically insulation and performance. It is compliant with surface at low pressure, optimizing heat transfer. fiberglass reinforcing provides excellent m...

non silicone thermal insulator k=2.0
Specification: 320*320*0.25
Detail: XK-FN20 has excellent thermal performance and excellent mechanical characteristics. Smooth surface allows complete contact between heat source and heat sink. It is fiberglass reinforced for excellent electrically insulation an...


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