Silicone free thermal compound

EMI absorbing materi(1)
Non silicone thermal(3)
Non silicone thermal(9)
non-silicone based,t(3)
Silicone free therma(2)
Thermal Gap Filler(1)
Thermal Gel(1)
thermally conductive(2)

SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.

All Products >> Silicone free thermal compound

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silicone free thermal compond k=0.8
Specification: 400ML
Detail: XK-SN10 is a two part thermal compound with high bond strength, it is supplied in two-part, suitable for automated dispensing. It can cure at room temperature, or can be accelerated with additional heat. It is ideal for motor ...

silicone free thermal compound k=1.5
Specification: 400ML
Detail: XK-SN20 is a two part, epoxy resin based thermal gap filling material with high bonding strength, this material is suitable for automated dispensing. It cures at room temperature or can be accelerated with additional heat. It ...


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SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD. All Products >> Silicone free thermal compound

SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.

All Products >> Silicone free thermal compound