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Product Name: |
Non silicone thermal pad K=5.0
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Supply Ability: |
100000 |
Related proudcts |
thermal pad, non silicone thermal, non silicone, |
Specifications |
320*320*1.0 |
Price Term: |
FOB |
Port of loading: |
1 |
Minimum Order |
1 |
Unit Price: |
1 |
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XK-PN50 is a soft and compliant thermal gap filler pad with thermal conductivity of 5.0W/mK. It offers exceptional thermal performance at low pressure due to low-modulus formulation. Designed for silicone-sensitive applications, offering high electrical insulation and excellent thermally conductive. |
Company: |
SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.
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Contact: |
Ms. huayan Luo |
Address: |
Room 616,619, huafeng xin 'an commercial building, zone 45, bao 'an district, shenzhen |
Postcode: |
518101 |
Tel: |
0755-27579310 |
Fax: |
0755-27579350 |
E-mail: |
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