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SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.

Products >> Silicone free thermal compound K=1.5

Silicone free thermal compound K=1.5

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Description
Product Name: Silicone free thermal compound K=1.5
Supply Ability: 100000
Related proudcts thermal, silicone free therma, therma compound,
Specifications 400ML
Price Term: FOB
Port of loading: 1
Minimum Order 1
Unit Price: 1

XK-SN20 is a two part, epoxy resin based thermal gap filling material with high bonding strength, this material is suitable for automated dispensing. It cures at room temperature or can be accelerated with additional heat. It is ideal for motor thermal management.

Contact Us
Company: SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.
Contact: Ms. huayan Luo
Address: Room 616,619, huafeng xin 'an commercial building, zone 45, bao 'an district, shenzhen
Postcode: 518101
Tel: 0755-27579310
Fax: 0755-27579350
E-mail:         


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Tel : 0755-27579310 Fax : 0755-27579350
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