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Product Name: |
Silicone free thermal compound K=1.5
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Supply Ability: |
100000 |
Related proudcts |
thermal, silicone free therma, therma compound, |
Specifications |
400ML |
Price Term: |
FOB |
Port of loading: |
1 |
Minimum Order |
1 |
Unit Price: |
1 |
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XK-SN20 is a two part, epoxy resin based thermal gap filling material with high bonding strength, this material is suitable for automated dispensing. It cures at room temperature or can be accelerated with additional heat. It is ideal for motor thermal management. |
Company: |
SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD.
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Contact: |
Ms. huayan Luo |
Address: |
Room 616,619, huafeng xin 'an commercial building, zone 45, bao 'an district, shenzhen |
Postcode: |
518101 |
Tel: |
0755-27579310 |
Fax: |
0755-27579350 |
E-mail: |
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